Requirements

Our Strength

Thermal conductivity

High thermal conductivity (≥ 180W/mK) ? Working efficiency

Hardness

Over 1200 Hv? Long life time

Dimension

Within ±10um For better Placement accuracy

Flatness

Under 2um  ? Stability for Bump soldering uniformity

Thermal Expansion

Under 5ppm < 1000 °CFor better placement accuracy

General Product

Innertron TC Bonding Tool

Flatness

Parallelization

Flatness

Parallelization

Top

2.0um

-

1.8um

-

Bottom

-

2.0um

-

1.7um

Innertron TC Bonding Tool

Flatness

Parallelization

Side A

-

1.0um

Side B

1.0um

1.9um